General Information
The 17th IEEE International Conference on IC Design and Technology (ICICDT) is the global forum for interaction and collaboration of IC design and technology for "accelerating product time-to-market". Close collaboration of the multi-discipline technical fields design/device/process accelerates the implementation of new designs and new technologies into manufacturing.
第17届IEEE国际集成电路设计与工艺会议（ICICDT）作为集成电路领域内的全球性论坛，致力于“加速面向市场的产品开发”，致力于融合集成电路设计与工艺领域交流与协作，通过在设计/器件/工艺等多学科技术领域紧密协作，加速设计及技术面向半导体制造领域的开发与应用。
ICICDT 2019 will be held in the historical garden city of China --- Suzhou during June 17th to June 19th, 2019.
ICICDT 2019 将于2019年6月17日-19日在历史文化名城及国家花园城市中国苏州举办。
The ICICDT 2019 Call for Papers is available for download.
ICICDT 2019 征文通知可供下载。
Design and technology co-optimization provide key advantage in the highly competitive market today. However, integrated circuit (IC) engineering traditionally separates design and technology and the two don’t use the same language, let alone understand each other. This is not a winning approach moving forward. Savvy IC engineers require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window. ICICDT is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary by bringing design, technology, and process experts together. Its unique format of each paper has a short presentation and a poster is designed to encourage asking questions and sharing knowledge on a one to one basis during the poster session.
当今高度竞争的集成电路市场环境下，设计与工艺的联合优化具有巨大的技术优势。然而，传统的集成电路（IC）工程将设计和工艺两方面进行分隔，设计和工艺两方面各自独立发展不能互通共融，不利于集成电路行业良性发展。一名优秀的IC工程师需要深度理解设计与工艺的相互依赖互相依存关系，从而进一步扩展产品开发优化空间。鉴于此，一个面向工程师、研发人员、学生和教授的学术论坛（IEEE国际集成电路设计与工艺会议，ICICDT）由此创立，该论坛突破设计和工艺固有局限，汇集海内外集成电路设计、技术和工艺等相关专家于一堂。
Contributed papers are solicited but not limited in the following subject areas:
征文范围包含但不限于以下领域：
- Advanced materials and processing technologies, Power semiconductor technologies and circuits
先进材料与加工技术，功率半导体技术与电路系统 - Advanced transistor and interconnect structures
先进的晶体管和互连结构 - Advanced Packaging, vertical (2.5D/3D) integration
先进封装、垂直（2.5d/3D）集成 - Variation and fault-tolerant designs, Reliability issues and mitigation approaches, EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
变异与容错设计，可靠性问题及解决方案，EDA（电子设计自动化）和跨系统、电路、器件级的高性能、能效、产量和/或可靠性的设计优化 - RF, analog, mixed signal, and I/O circuits for future technology generations
面向下一代技术体系的射频、模拟、混合信号和I/O电路系统 - Simulation and modeling of advanced processes, devices, and circuits
先进的过程、设备和电路的仿真和建模 - Design for manufacturing, yield, and test, System-on-Chip (SoC) and system-in-package (SiP) design integration
制造、产能、测试方案设计，片上系统（SoC）与系统级封装（SIP）设计集成 - Emerging technologies, circuits and Applications (MEMS, memory, Internet of Thing, Autonomous cars, Machine Learning, Artificial Intelligence)
电路系统新兴技术应用（MEMS、存储器、物联网、自动驾驶汽车、机器学习、人工智能等）
